#AGI
TechInsights 最新拆解發現，華為 Ascend 910C AI 晶片內含台積電、三星與 SK 海力士的先進元件，儘管中國宣稱該晶片為「國產」設計。台積電表示其分析樣本於 2024 年 10 月前生產，此舉突顯中國 AI 晶片發展仍依賴外國技術，亦對供應鏈管控帶來更多審視。
A new teardown report by TechInsights reveals that Huawei’s Ascend 910C AI chips include components from TSMC, Samsung, and SK Hynix — despite being branded as domestically made. TSMC confirmed the analyzed dies were fabricated before October 2024. The findings reignite scrutiny over China’s AI ambitions and the lingering dependence on foreign hardware.
- 🔍 Why it matters: The report challenges the narrative of self-sufficiency in China’s AI chip strategy.
- 🌍 The big picture: Global AI hardware supply chains remain deeply entangled — even amid rising tech nationalism.
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Full article https://www.bloomberg.com/news/articles/2025-10-03/huawei-used-tsmc-samsung-sk-hynix-components-in-top-ai-chips