#HKStartups 科大最新研發晶片技術結合 MicroLED 和異質封裝，為數據中心及未來 6G 通訊節能提效。這款「樂高式」集成晶片兼容現有光纖架構，大幅降低伺服器通訊耗電，並望三年內打造原型。同場亦展示 28GHz 衞星波束成型器，標誌香港科研在低軌通訊與 AI 晶片應用上邁進重要一步。
HKUST has unveiled a novel semiconductor chip that leverages MicroLED and heterogeneous integration (HISiP) to improve energy efficiency in data centres and next-gen 6G networks. Designed like “Lego blocks,” the chip boosts speed while slashing power consumption, all within existing fibre infrastructure. A prototype for a 28GHz satellite beamformer was also showcased, advancing Hong Kong’s role in space communications and AI chip development.
📌 一杯咖啡價錢連接 Web3 世界 https://patreon.com/wanszezit
Full article https://www.ejtech.ai/ceoai/%e7%a7%91%e5%a4%a7-%e6%99%b6%e7%89%87-%e6%95%b8%e6%93%9a%e4%b8%ad%e5%bf%83-%e6%85%b3%e9%9b%bb-%e7%95%b0%e8%b3%aa%e5%b0%81%e8%a3%9d-microled-%e9%80%9a%e8%a8%8a%e5%85%89%e6%ba%90/